Method of manufacturing via interconnection of glass-ceramic wiring board
AssigneeHitachi, Ltd.
InventorsNorihiro Ami, Masahide Okamoto, Shosaku Ishihara, Minoru Tanaka, Mutsumi Horikoshi, Akihiro Yasuda
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Abstract
A via interconnection of a glass-ceramic wiring board is made by blending a copper powder to a vehicle including a cellulose derivative, adding a metal oxide powder having a mean particle diameter of from at least 1 μm to at most 4 μm to the vehicle and blending them, adjusting the viscosity of the vehicle by adding the cellulose derivative and filling them to a via; and sintering the via at a temperature of at least 900° C. to at most 1060° C., and forming the via interconnection.
Claims3
A method for manufacturing a via interconnection of a glass-ceramic wiring board, comprising the steps of:
- blending a copper powder to a vehicle comprising a cellulose derivative;
- adding a metal oxide powder having a mean particle diameter of from at least 1 μm to at most 4 μm to said vehicle and blending them;
- adjusting the viscosity of said vehicle by adding said cellulose derivative and filling them to a via;
- and
- sintering said via at a temperature of at least 900° C. to at most 1060° C., and forming said via interconnection.
A method for manufacturing a via interconnection of a glass-ceramic wiring board, comprising the steps of:
- blending a copper powder to a vehicle comprising a cellulose derivative;
- adding a metal oxide powder having a mean particle diameter of from at least 1 μm to at most 4 μm to said vehicle and blending them;
- adjusting the viscosity of said vehicle by adding said cellulose derivative and filling them to a via;
- and
- sintering said via at a temperature of from at least 900° C. to at most 1060° C. and forming said via interconnection,
- wherein said metal oxide is dispersed in said via such that the mean interval of said metal oxide is at most 7.4 μm.
Dependencies are inferred from the claim text.