Method for fabricating connectors for interconnecting etched tri-metal circuit structures
AssigneeVisteon Global Technologies, Inc.
InventorsLakhi Nandlal Goenka, Mohan R. Paruchuri, Thomas B Krautheim
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Abstract
In conventional ETM circuit structures a pin connector in which the pin is etched from the ETM substrate and the mating cavity is etched from the ETM substrate to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin serves as an anchor with the metallurgical bonds with solder in the cavity that forms on the copper surfaces of the ETM circuit structure to give good mechanical strength to the connection. In particular four different configurations of interconnections are shown and described.
Claims8
A method for fabricating a connector for interconnecting the substrates of Etched Tri-Metal circuit structures comprising the steps of:
- a. securing a first tri-metal layer material having a first metal with parallel broadside surfaces overlaid on each broadside with a second metal layer, said second metal layer bonded to said first metal;
- b. disposing etch-resist masks on the exposed surface of each second metal layer defining first and second circuit patterns including at least one pedestal pattern;
- c. etching said second metal layer forming said first and second circuit patterns and exposing said first metal free of circuit patterns;
- d. bonding one of the second metal layers to a substrate;
- e. etching the first metal in areas free of circuit patterns to form one or more pedestal patterns on the first circuit;
- f. securing a second tri-metal layer material and performing the aforementioned steps a-e on the second tri-metal material;
- g. spreading a bonding material on one of the first circuit pattern for joining the pedestal patterns on each substrate in an interlocking manner;
- h. meshing the first and second substrates in such a manner that the bonding material flows about and around the pedestal patterns on each of the first and second substrates;
- and then
- i. activating the bonding material forming a bond between the pedestal patterns of the first and second substrates.
Dependencies are inferred from the claim text.