Method of controlling shock and vibration of electrical interconnects

The method of controlling the micro-motion between an electronic module and a printed circuit board, said module containing a convex surface, comprising:

• providing an interconnection between one or more contact pads on a surface of the printed circuit board and the corresponding contact sites on a surface of an electronic module,
• positioning an interposer member between said printed circuit board and the convex surface of said module, said interposer member including a compressible electrically conductive spring element for each contact pad and its corresponding contact site, and further including two spacedly positioned stops projecting from the interposer member toward said module, such that the combined height of the stops is at least equal to the maximum expected curvature of the convex surface, whereby the stops engage the perimeter of the module.

A method of making a sub-assembly, comprising providing an electronic module having a generally planar surface, providing an interposer having a generally planar surface mated with said surface of the module, and a housing surrounding the module, clamping the module and the interposer together, and providing limit means to restrict the relative movement of said module wit respect to said interposer when said subassembly is subject to shock and/or vibration, said limit means including restraints on two contiguous sides of the interposer housing serving to restrict relative sliding movement along the x-axis and y-axis parallel to the generally planar surfaces and at least two stops to limit rocking movement of the module in the z-axis with respect to the interposer due to lack of planarity between the two mating surfaces.