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US 6,658,727 B2Granted
Method for assembling die package
AssigneeMicron Technology, Inc.
InventorPatrick W. Tandy
Life of this patent
Estimating the term…
Abstract
A method of assembling a multi-chip module does not necessitate more the one pass through a die attach machine. The method involves attaching a smaller die to a larger die without using a die attach machine. The larger die may be attached to a support structure using a die attach machine.
Claims7
A method of assembling multi-chip modules comprising:
- singulating a first, relatively smaller die;
- attaching the smaller die to a second, relatively larger die without using a die attach machine;
- singulating the larger die;
- and
- attaching the smaller and larger die to a support structure using a die attach machine.
2 more elements
Dependencies are inferred from the claim text.