Transfer molding of integrated circuit packages

A method for encapsulating and underfilling an integrated circuit chip assembly comprising the steps of:

• providing an integrated circuit assembly including an integrated circuit chip mounted on a substrate in a standoff relationship;
• providing a mold having a first cavity, a second cavity and a least one channel interconnecting said first and second cavities such that said at least one channel connects to said first cavity at least at one location;
• positioning said mold over said integrated circuit assembly such that said integrated circuit chip is located in said first cavity;
• applying a clamping force to hold the substrate against the mold;
• injecting encapsulant into said first cavity of said mold remotely at two locations spaced from the point of connection of said at least one channel to said cavity, generally in the direction of the connection of the channel to the first cavity, one of said locations being in the vicinity of the top of the integrated circuit chip, and the other being in the vicinity of the space between the integrated circuit chip and the substrate, such that encapsulant flows around and underneath the integrated circuit chip and through the channel into said second cavity to thereby underfill and encapsulate said integrated circuit assembly.