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US 6,656,771 B2Granted
Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes: a support member (20) on which a land (24) is formed; a semiconductor chip (10) having a bump for an electrode (12) that is disposed on the land (24), and to be bonded face-down to a support member (20); and resin (30) which is provided as an adhesive between the semiconductor chip (10) and the support member (20), which is allowed to contract on hardening, and which causes pressure-bonding between the land (24) and the bump (12) by the stress due to this hardening contraction. The stress therein is partially absorbed by elastic deformation of at least the support member (20).
Claims27
A semiconductor device comprising:
- a support member on which is formed an interconnecting pattern including a land;
- a semiconductor chip to be bonded face-down to the support member and having a bump that is disposed on the land;
- and
- resin which provides adhesion between the semiconductor chip and the support member and which contracts on hardening, to cause the land and the bump to be pressure-bonded by stress due to the hardening contraction, the resin formed to extend to side surfaces of the semiconductor chip,
- wherein the stress is partially absorbed by elastic deformation of the support member, without changing the shape of the land.
2 more elements
A semiconductor device comprising:
- a substrate on which is formed an interconnecting pattern including a land, with an adhesive therebetween;
- a semiconductor chip to be bonded face-down to the substrate and having a bump that is disposed on the land;
- and
- resin which provides adhesion between the semiconductor chip and the substrate and which contracts on hardening, to cause the land and the bump to be pressure-bonded by stress due to the hardening contraction, the resin formed to extend to side surfaces of the semiconductor chip,
- wherein the relationship between the elastic modulus EM of the resin and the elastic modulus EA of the adhesive is such that:
- EM>EA
- and the stress is partially absorbed by elastic deformation of at least the adhesive.
4 more elements
A semiconductor device comprising:
- a substrate on which is directly formed an interconnecting pattern including a land;
- a semiconductor chip to be bonded face-down to the substrate and having a bump that is disposed on the land;
- and
- resin which provides adhesion between the semiconductor chip and the substrate and which contracts on hardening, to cause the land and the bump to be pressure-bonded by stress due to the hardening contraction, the resin formed to extend to side surfaces of the semiconductor chip,
- wherein the relationship between the elastic modulus EM of the resin and the elastic modulus ES of the substrate is such that:
- EM>ES
- and the stress is partially absorbed by elastic deformation of at least the substrate.
4 more elements
A circuit board on which is formed an interconnecting pattern including a land, with an adhesive therebetween,
- wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump on the land;
- resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, the land and the bump are pressure-bonded by stress due to the hardening contraction, and the stress is partially absorbed by elastic deformation of the adhesive, without changing the shape of the land,
- wherein the resin is formed to extend to side surfaces of the semiconductor chip.
A circuit board on which is directly formed an interconnecting pattern including a land,
- wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, the land and the bump are pressure-bonded by stress due to the hardening contraction, and the stress is partially absorbed by elastic deformation of the circuit board, without changing the shape of the land,
- wherein the resin is formed to extend to side surfaces of the semiconductor chip.
A circuit board on which is formed an interconnecting pattern including a land, with an adhesive therebetween,
- wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, and the land and the bump are pressure-bonded by stress due to the hardening contraction, the resin formed to extend to side surfaces of the semiconductor chip;
- wherein the relationship between the elastic modulus EM of the resin and the elastic modulus EA of the adhesive is such that:
- EM>EA;
- and
- wherein the stress is partially absorbed by elastic deformation of at least the adhesive.
2 more elements
A circuit board on which is directly formed an interconnecting pattern including a land,
- wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, and the land and the bump are pressure-bonded by stress due to the hardening contraction, the resin formed to extend to side surfaces of the semiconductor chip;
- wherein the relationship between the elastic modulus EM of the resin and the elastic modulus ES of the circuit board is such that:
- EM>ES;
- and
- wherein the stress is partially absorbed by elastic deformation of at least the circuit board.
2 more elements
A method of connecting a semiconductor chip, the method comprising:
- bonding a semiconductor chip in a face-down manner to a support member on which is formed an interconnecting pattern including a land, in such a manner that a bump is disposed on the land;
- and
- providing a resin as an adhesive between the semiconductor chip and the support member, causing the resin to harden on contraction, and pressure-bonding the land and the bump by stress due to the hardening contraction, providing the resin to extend to side surfaces of the semiconductor chip,
- wherein the shape of the land is maintained while the support member is deformed elastically, to absorb the stress partially.
1 more element
A method of connecting a semiconductor chip, the method comprising:
- bonding a semiconductor chip in a face-down manner to a substrate on which is formed an interconnecting pattern including a land, with an adhesive therebetween, in such a manner that a bump is disposed on the land;
- providing a resin as an adhesive between the semiconductor chip and the substrate, causing the resin to harden on contraction, and pressure-bonding the land and the bump by stress due to the hardening contraction, providing the resin to extend to side surfaces of the semiconductor chip,
- wherein the relationship between the elastic modulus EM of the resin and the elastic modulus EA of the adhesive is such that:
- EM>EA;
- and
- wherein at least the adhesive is deformed elastically, to absorb the stress partially.
3 more elements
A method of connecting a semiconductor chip, the method comprising:
- bonding a semiconductor chip in a face-down manner to a substrate on which is directly formed an interconnecting pattern including a land, in such a manner that a bump is disposed on the land;
- and
- providing a resin as an adhesive between the semiconductor chip and the substrate, causing the resin to harden on contraction, and pressure-bonding the land and the bump by stress due to the hardening contraction, providing the resin to extend to side surfaces of the semiconductor chip,
- wherein the relationship between the elastic modulus EM of the resin and the elastic modulus ES of the substrate is such that:
- EM>ES;
- and
- wherein at least the substrate is deformed elastically, to absorb the stress partially.
4 more elements
Dependencies are inferred from the claim text.