Method of forming a stack of packaged memory dice
AssigneeMicron Technology, Inc.
InventorsJerrold L. King, Jerry M. Brooks
Life of this patent
Estimating the term…
Abstract
A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devices and external circuitry.
Claims13
A stack-forming method for a stack of packaged integrated circuit semiconductor devices on a board having a multiport connector having at least one port comprising:
- attaching a first packaged semiconductor device having a plurality of terminals to the board;
- attaching a second packaged semiconductor device having a plurality of terminals to the first packaged semiconductor device;
- and
- connecting a multiconductor flexible assembly between at least one terminal of the plurality of terminals on the first packaged semiconductor device and at least one terminal of the plurality of terminals on the second packaged semiconductor device and the at least one port of the multiport connector.
A stack-forming method for a packaged semiconductor device assembly on a support surface having a first multiconductor assembly on the support surface, the first multiconductor assembly having at least one contact pad, comprising:
- providing a first packaged semiconductor device having bond pads thereon;
- providing a second packaged semiconductor device having bond pads thereon;
- positioning the first packaged semiconductor device on the first multiconductor assembly having at least one bond pad of the first packaged semiconductor device contacting the at least one contact pad of the first multiconductor assembly;
- positioning a second multiconductor flexible assembly on the first packaged semiconductor device, the second multiconductor flexible assembly including at least one contact pad;
- and
- positioning a second packaged semiconductor device having at least one bond pad thereof contacting the at least one contact pad of the second multiconductor flexible assembly.
A method for assembling a semiconductor assembly on a board having a multiconductor port thereon comprising:
- providing a first packaged semiconductor device having a plurality of bond pads;
- providing a first multiconductor assembly having a plurality of contact pads thereon;
- providing a second packaged semiconductor device having a plurality of bond pads thereon;
- providing a second multiconductor assembly having a plurality of contact pads thereon;
- attaching the first packaged semiconductor device to the board;
- positioning the first multiconductor assembly on the first packaged semiconductor device having at least one contact pad of the plurality of contact pads of the first multiconductor assembly contacting at least one bond pad of the plurality of bond pads of the first packaged semiconductor device;
- positioning the second packaged semiconductor device on the first multiconductor assembly;
- and
- positioning the second multiconductor assembly on the second packaged semiconductor device having at least one contact pad of the plurality of contact pads of the second multiconductor assembly contacting at least one bond pad of the plurality of bond pads of the second packaged semiconductor device.
Dependencies are inferred from the claim text.