Semiconductor device having chip scale package
AssigneeKabushiki Kaisha Toshiba
InventorKazuyuki Noshita
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Abstract
A first surface of a semiconductor chip and an upper surface of a circuit board are bonded with a pad of the semiconductor chip fitted to a first opening of the circuit board. The pad is electrically connected to a wire of the circuit board. The pad is sealed with a first resin. A second resin is disposed on the upper surface of the circuit board. A second resin includes an upper surface at a height substantially equal to a height of a second surface of the semiconductor chip at a point apart from a corner of a square of the first surface of the semiconductor chip.
Claims5
A manufacturing method of a semiconductor device comprising:
- bonding a first surface of a semiconductor chip and an upper surface of a circuit-board with a pad of the semiconductor chip fitted to a first opening of the circuit board;
- electrically connecting the pad to a wire of the circuit board;
- sealing the pad with a first resin;
- and
- forming a second resin disposed on the upper surface of the circuit board, and including an upper surface at a height substantially equal to a height of a second surface of the semiconductor chip at a point apart from a corner of a square of the first surface of the semiconductor chip.
Dependencies are inferred from the claim text.