Fabricating very thin chip size semiconductor packages
AssigneeAmkor Technology, Inc.
InventorVincent DiCaprio
Life of this patent
Estimating the term…
Abstract
A method for fabricating LGA-, LCCY- and BGA-types of very thin, chip size semi-conductor packages (“VCSP's”) includes substantially reducing the thickness of a semiconductor wafer containing the semiconductor chips to be packaged by grinding and/or etching the wafer from its back side prior to singulation of the chips from the wafer. The thinned-down chips thus produced are electrically connected to corresponding insulative substrates contained in an integral array thereof using the “flip chip” interconnection method. The narrow row space between the chips and the substrates are sealed with an underfill material, and the individual, finished VCSP's are then singulated from the array.
Claims18
A method of making a very thin chip size semiconductor package (“VCSP”), comprising:
- providing an insulative substrate having a plurality of conductive pads on a first surface thereof, a plurality of lands on a second surface thereof, and means for electrically connecting the pads to the lands through the substrate;
- providing a semiconductor die having a first surface with a plurality of conductive pads thereon and a thickness substantially less than an initial thickness of a semiconductor wafer from which the die was singulated;
- forming a flip chip electrical connection between the die and the substrate;
- and,
- underfilling a space defined between the respective first surfaces of the die and the substrate and circumscribing a periphery of the die with a first insulative material;
- and
- filling a space around the periphery of the die and above the first insulative material with a second insulative material, said second insulative material contacting the first insulative material outward of the periphery of the die.
Dependencies are inferred from the claim text.