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US 6,656,761 B2Granted
Method for forming a semiconductor device for detecting light
AssigneeMotorola, Inc.
InventorsSebastian M. Csutak, Burt W. Fowler
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Abstract
A method of forming a resonant cavity device useful for optoelectronic applications is disclosed. A monocrystalline top semiconductor substrate is wafer bonded to a mirror formed over or within a bottom semiconductor substrate. A top mirror is formed over or within the top semiconductor substrate.
Claims9
A method for forming a semiconductor device for detecting light, the method comprising:
- providing a semiconductor substrate;
- forming a first reflective stack overlying the semiconductor substrate;
- wafer bonding a semiconductor layer to the first reflective stack wherein the semiconductor layer overlies the first reflective stack;
- forming a plurality of electrodes within a top portion of the semiconductor layer;
- and
- forming an inlaid second reflective stack within the semiconductor layer and overlying the plurality of electrodes.
3 more elements
Dependencies are inferred from the claim text.