Method of producing semiconductor element, semiconductor element, and gyroscope
AssigneeCanon Kabushiki Kaisha
InventorsKoichiro Nakanishi, Takahiro Numai
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Abstract
A method of producing a semiconductor element is disclosed which comprises a step of preparing a semiconductor element member comprising a projection region on a substrate, a step of embedding an upper surface of the substrate, and upper and side surfaces of the projection region in a potting material, an exposure step of exposing the upper surface of the projection region, a deposition step of depositing an electrode material on the upper surface of the projection region, and a step of removing the potting material.
Claims11
A method of producing a semiconductor element, comprising:
- a step of preparing a semiconductor element member comprising on a substrate a projection region having an electrode material formed on an upper surface thereof;
- a step of forming a first passivation film on an upper surface of the substrate, and an upper surface and a side surface of the projection region;
- a step of forming a second passivation film on the first passivation film;
- an exposure step of removing the second passivation film on the upper surface of the projection region to expose the first passivation film, the remaining second passivation film having a portion with an inclined surface;
- a step of removing the first passivation film on the upper surface of the projection region;
- and
- a step of removing the remaining second passivation film on the first passivation film.
A method of producing a semiconductor element, comprising:
- a step of preparing a semiconductor element member comprising on a substrate a projection region having an electrode material formed on an upper surface thereof;
- a step of forming a first passivation film on an upper surface of the substrate, and an upper surface and a side surface of the projection region;
- a step of forming a second passivation film on the first passivation film, the second passivation film having a portion with an inclined surface;
- an exposure step of removing the second passivation film on the upper surface of the projection region to expose the first passivation film;
- a step of removing the first passivation film on the upper surface of the projection region;
- and
- a step of removing the remaining second passivation film on the first passivation film.
Dependencies are inferred from the claim text.