Method of forming a semiconductor chip carrier

A method of forming a carrier for a semiconductor chip, said method comprising:

• providing a substratc having a plurality of first contact points on a first surface and a plurality of second contact points on a second surface;
• providing one or more clips having a first member that is attachable to said substrate and a second member separated from said first member by a variable distance;
• positioning said semiconductor chip on said second surface of said substrate;
• disposing a cover member on said semiconductor chip;
• and
• positioning said one or more clips on said substrate such that said first member of each of said one or more clips is attached to said substrate and said second member of each of said one or more clips is in contact with said cover member, said second member having an outwardly tapering profile corresponding to a profile of a notch in said cover member, said variable distance being increased such that a force is exerted on said cover member by said one or more clips, whereby said semiconductor chip is substantially secured on said substrate.

A method of forming a carrier for a semiconductor chip, said method comprising:

• providing a substrate having a plurality of first contact points on a first surface and a plurality of second contact points on a second surface, said plurality of first contact points being electrically connected to a testing device containing external circuitry;
• positioning said semiconductor chip on said second surface of said substrate, wherein a plurality of contact elements of said semiconductor chip are electrically connected to said plurality of second contact points;
• disposing a cover member on said semiconductor chip;
• applying a force on said cover member toward said substrate by using one or more clips attached to said substrate, whereby said semiconductor chip is temporarily secured to said substrate, said one or more clips comprising:
• a first member;
• and
• a second member displaced from said first member and having an outwardly tapering profile corresponding to a profile of a notch in said cover member;
• conducting a testing operation on said semiconductor chip with said external circuitry;
• and
• removing said semiconductor chip from said substrate.

A method of forming a carrier for a semiconductor chip, said method comprising:

• providing a first substrate layer having a plurality of first contact points on a surface thereof;
• providing a second substrate layer disposed on said first substrate layer, said second substrate layer including a plurality of second contact points on a surface thereof, said plurality of first contact points being connected to said plurality of second contact points by a plurality of electrical traces;
• providing a cover member having a notch and being disposed over and separated from said second substrate layer;
• and
• providing one or more clips for generating a force on said cover member toward said second substrate layer, each of said one or more clips including:
• a first member attached to at least one of said first substrate layer and said second substrate layer;
• a second member displaced from said first member and having an outwardly tapering profile corresponding to a profile of the notch in said cover member, wherein the notch mechanically locks said one or more clips in position with respect to said cover member;
• and
• an elbow segment integrally attached to both of said first member and said second member, said elbow segment generating at least part of said force upon being deformed.

A method of forming a carrier for a semiconductor chip, said method comprising:

• providing a substrate having a plurality of first contact points on a first surface and a plurality of second contact points on a second surface;
• and
• attaching a plurality of clips to said substrate, each of said clips including:
• a first member in contact with said substrate;
• a second member separated from said first member by a variable distance, said second member having an outwardly tapering profile corresponding to a profile of a notch in a cover member;
• and
• an elbow segment integrally attached to both said first member and said second member, wherein said elbow segment generates a force tending to move said second member nearer to said first member when said variable distance is greater than an equilibrium value, wherein a semiconductor chip receiving region is at least partially defined by said second surface of said substrate and by said plurality of clips.

A method of forming a connection for a semiconductor chip to external circuitry, the method comprising:

• providing a substrate having:
• a first surface having thereon a plurality of first contact points having a first pitch;
• and
• a second surface having thereon a plurality of second contact points having a second pitch smaller than said first pitch;
• providing a semiconductor chip disposed on said substrate such that a plurality of contact elements of said semiconductor chip are in contact with said plurality of second contact points, wherein an exclusion region is defined by:
• beginning at said semiconductor chip and extending perpendicularly away from said substrate;
• and
• laterally bounded by a perimeter beginning at the periphery of said semiconductor chip and extending perpendicularly away from said substrate;
• providing a cover member disposed on said semiconductor chip;
• and
• providing one or more clips attached to said substrate, each of said one or more clips generating a force on said cover member, whereby said cover member substantially secures said semiconductor chip on said substrate, said one or more clips being positioned outside of the exclusion region, said one or more clips comprising:
• a first member;
• and
• a second member displaced from said first member and having an outwardly tapering profile corresponding to a profile of a notch in said cover member.