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US 6,656,422 B2Granted
Die-bonding solder materials
AssigneeYamatake Corporation
InventorTakashi Masuda
Life of this patent
Estimating the term…
Abstract
The invention includes a die-bonding solder material having tin and gold. The composition ratio of tin and gold includes a eutectic point defined by having more content of tin than the content of gold. The die-bonding solder material further includes a metal additive having a higher melting point than tin, forming no eutectic with tin, and having a higher eutectic point with gold than the melting point of an eutectic of tin gold.
Claims8
A die-bonding solder material comprising:
- tin;
- gold, wherein a composition ratio of tin and gold includes a eutectic point having 90 to 95 percent by weight tin;
- a metal additive having a higher melting point than tin, forming no eutectic with tin, and having a higher eutectic point with gold than the melting point of an eutectic of tin gold;
- wherein the metal additive ranges from 0.1 to 9% by weight of the tin-gold-metal additive composition;
- and
- wherein the metal additive is germanium.
3 more elements
A die-bonding solder material consisting of:
- tin;
- gold, wherein a composition ratio of tin and gold include a eutectic point having 90 to 95 percent by weight tin;
- and
- a metal additive having a higher melting point than tin, forming no eutectic with tin, and having a higher eutectic point with gold than the melting point of an eutectic of tin and gold;
- wherein the metal additive ranges from 0.1 to 9% by weight of the tin-gold-metal additive composition;
- and
- wherein the metal additive is silicon.
4 more elements
A die-bonding solder material consisting essentially of:
- tin;
- gold, wherein a composition ratio of tin and gold include a eutectic point having 90 to 95 percent by weight tin;
- a metal additive having a higher melting point than tin, forming no eutectic with tin, and having a higher eutectic point with gold than the melting point of an eutectic of tin and gold, wherein the metal additive ranges from 0.1 to 9% by weight of the tin-gold-metal additive composition, wherein the metal additive is silicon;
- and
- wherein the die-bonding solder material is used for bonding components of a pressure transducer.
2 more elements
A die-bonding solder material consisting essentially of:
- tin;
- gold, wherein a composition ratio of tin and gold include a eutectic point having 90 to 95 percent by weight tin;
- a metal additive having a higher melting point than tin, forming no eutectic with tin, and having a higher eutectic point with gold than the melting point of an eutectic of tin and gold, wherein the metal additive ranges from 0.1 to 9% by weight of the tin-gold-metal additive composition, wherein the metal additive is silicon;
- and
- wherein the die-bonding solder material is used for bonding components of a pressure transducer, the pressure transducer including a pressure sensor, a carrier and a base coupled between the pressure sensor and the carrier, wherein the die-bonding solder material is used to bond the base to the carrier.
2 more elements
Dependencies are inferred from the claim text.