Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors

A method of reuse of a slurry effluent containing agglomerations of abrasive grains which has been used in polishing step in the manufacture of semiconductor, comprising the steps of:

• crushing the agglomerations of abrasive grains contained in the slurry effluent in a crushing chamber, wherein the crushing step is performed using a pressurizing circulation process, where the pressurizing circulation process crushes the agglomerations of abrasive grains by causing an impingement of a pressurized slurry effluent against an inner wall of the crushing chamber while circulating the slurry effluent;
• after crushing the agglomerations of abrasive grains, adjusting concentration and pH of the slurry effluent by adding fresh slurry fluid or regenerated slurry fluid thereto;
• after adjusting the concentration and pH of the slurry effluent, concentrating the slurry effluent by separating the slurry effluent into a concentrate fluid and a permeate fluid using a concentrating membrane;
• regenerating an abrasive fluid using the concentrate fluid containing the crushed abrasive grains;
• and
• cleansing the concentrating membrane using the permeate fluid.