Method of manufacturing multilayer substrates
AssigneeHewlett-Packard Development Company, L.P.
InventorHannsjorg Obermaier
Life of this patent
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Abstract
A multi-layered substrate is manufactured utilizing a sheet material. The sheet material is a dielectric material with a dielectric adhesive coated on one side. A catalyst layer is at a boundary between the dielectric material and the adhesive. The catalyst layer is thin in comparison to the dielectric material and the dielectric adhesive. In the manufacture of the multi-layered substrate, the material is processed using patterning and metallizing steps. During this manufacture the processed sheet material may be supported with a releasable layer. Laminating additional sheet materials onto previously processed sheets produces multiple layers. These additional sheets are then processed. Multiple lamination steps may be performed in order to obtain an end product of a desired number of layers.
Claims14
A method of manufacturing a multi-layered substrate, said method comprising:
- providing a plurality of raw sheets;
- providing a first raw sheet of the plurality of raw sheets, said step of providing said first raw sheet comprising:
- providing a first layer of dielectric material;
- providing a first layer of catalyst on said first layer of dielectric material;
- and
- coating a first layer of dielectric adhesive to said first layer of dielectric material such that said first layer of catalyst is intermediate said first layer of dielectric material and said first layer of dielectric adhesive;
- and
- patterning said first layer of dielectric material by ablating through said first layer of dielectric material to said first layer of catalyst thereby exposing said first layer of catalyst and forming a pad cavity in said first layer of dielectric material.
A method of manufacturing a multi-layered substrate, said method comprising:
- providing a plurality of raw sheets;
- providing a first raw sheet of the plurality of raw sheets, said step of providing said first raw sheet comprising:
- providing a first layer of dielectric material;
- providing a first layer of catalyst on said first layer of dielectric material;
- and
- coating a first layer of dielectric adhesive to said first layer of dielectric material such that said first layer of catalyst is intermediate said first layer of dielectric material and said first layer of dielectric adhesive;
- providing a conductive temporary release layer;
- laminating said first raw sheet to said conductive temporary release layer;
- patterning said first raw sheet, said patterning step comprising:
- ablating through said first layer of dielectric material to said first layer of catalyst thereby exposing said first layer of catalyst;
- and
- ablating through said first layer of catalyst and said first layer of dielectric adhesive thereby exposing said conductive temporary release layer and forming a stepped via cavity in said first raw sheet;
- and
- metallizing said subsequent layer of dielectric material by electroless deposition of metal into said stepped via cavity.
Dependencies are inferred from the claim text.