Soldering paste for hard-soldering and coating aluminum and aluminum alloys
AssigneeDegussa AG
InventorsJürgen Koch, Leander Staab, Wolfgang Kohlweiler, Karl-Anton Starz
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Abstract
A soldering paste for hard-soldering and coating working parts made of aluminum or aluminum alloys, which contains 25 to 35 percent in weight of a water-miscible organic binding agent on the basis of aliphatic glycols, 25 to 45 percent in weight of an aluminum hard-soldering powder, 25 to 45 percent in weight of an aluminum fluxing agent and, as an additive to influence the rheological properties, 0.01 to 0.2 percent by weight with respect to the total amount of one or several fatty acids with 10 to 20 C atoms and/or their ammonium salts.
Claims16
A soldering paste for hard-soldering and coating parts made of aluminum, aluminum alloys or combinations thereof, said paste containing 25 to 35 percent by weight of a water-miscible organic binding agent composed of an aliphatic glycol, 25 to 45 percent by weight of an aluminum hard-soldering powder, 25 to 45 percent by weight of aluminum fluxing agent, and an additive which is a member selected from the group consisting of one or more fatty acids with 10 to 20 C atoms, an ammonium salt of said one or more fatty acids and mixtures of one or more fatty acids and ammonium salts, in an amount of 0.01 to 0.2 percent by weight with respect to the total weight of the paste.
A method to influence the rheological properties of a soldering paste that is used for hard-soldering and coating parts made of aluminum or aluminum alloys comprising forming a composition that contains an aluminum hard-soldering powder in a water-miscible organic binding agent and an aluminum fluxing agent, and a fatty acid with 10 to 20 C atoms an ammonium salts thereof, or mixture thereof in a proportion of 0.01 to 0.2 percent by weight with respect to the total weight for raising the thixotropy and/or structural viscosity of said paste.
Dependencies are inferred from the claim text.