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US 6,656,283 B1Granted
Channelled chamber surface for a semiconductor substrate processing chamber
AssigneeApplied Materials, Inc.
InventorThorsten Lill
Life of this patent
Estimating the term…
Abstract
A method and apparatus for providing particle collection channels in a semiconductor substrate processing chamber. The channels are formed in either a chamber liner or directly into the walls and/or bottom of the chamber. The channels direct trapped particles toward a chamber exhaust port.
Claims9
An apparatus for use in a semiconductor substrate processing chamber, comprising:
- a chamber liner disposed at least partially on a bottom of the chamber, the chamber liner having a plurality of particle collection grooves;
- and
- the chamber liner has a first opening and a second opening, and wherein the first opening is adapted to receive a substrate support member therethrough and the second opening leads to an exhaust port, wherein each of the particle collection grooves extend from a location proximate the first opening to the second opening.
A semiconductor substrate processing chamber, comprising:
- an enclosure having an exhaust port;
- and
- a chamber liner disposed at least partially on a bottom of the chamber in the enclosure, the chamber liner having a plurality of particle collection grooves that lead to the exhaust port;
- the chamber liner having a first opening and a second opening, wherein the first opening is adapted to receive a substrate support member therethrough;
- and
- the second opening leads to the e port.
3 more elements
Dependencies are inferred from the claim text.