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US 6,656,275 B2Granted
Partial plating system
AssigneeShinko Electric Industries Co., Ltd.
InventorShigeki Iwamoto
Life of this patent
Estimating the term…
Abstract
A partial plating system able to gold plate only inner leads of a TAB frame, provided with a mask having an opening formed to correspond to a plating region of a TAB frame and provided horizontally; an elevating means for lowering the TAB frames toward the mask; and a pressing means for pressing the TAB frame on to the mask; a plating solution being sprayed from below the openings toward the openings to plate the plating region.
Claims5
A partial plating system comprising:
- a mask having an opening formed to correspond to a plating region of a TAB tape and provided horizontally;
- an elevating means for lowering said TAB tape toward said mask before start of plating and for raising said TAB tape away from said mask after completion of plating, said elevating means being provided with a plurality of guide means for use when said TAB tape is being transported in a longitudinal direction, said plurality of guide means being provided with guide grooves for receiving peripheral edges of the TAB tape in a transport direction;
- and
- a pressing means for pressing the TAB tape on to said mask;
- a plating solution being sprayed from below said opening toward said opening to plate said plating region.
2 more elements
Dependencies are inferred from the claim text.