Unsupported chemical mechanical polishing belt
AssigneeLam Research Corporation
InventorsCangshan Xu, Brian S. Lombardo
Life of this patent
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Abstract
A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes a polymeric layer forming an endless loop and having a polishing surface on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.
Claims11
A belt for polishing a workpiece in a chemical mechanical polishing system, the belt comprising:
- a single polymeric layer with no supplementary reinforcing or supporting components, the single polymeric layer forming an endless loop sized to fit the chemical mechanical polishing system, the single polymeric layer having a polishing surface formed on a polishing side of the polymeric layer.
A chemical mechanical polishing system for polishing a workpiece, the system comprising:
- an endless loop polishing belt with no supplementary reinforcing or supporting components, formed of a single layer of polymeric material having a polishing surface on one side;
- and
- transport means for moving the continuous loop belt past the workpiece.
A belt for polishing a workpiece in a chemical mechanical polishing system, the belt comprising:
- a single, polymeric layer hot-cast molded of a single, substantially uniform layer of polymeric material to form an endless loop sized to fit the chemical mechanical polishing system, the belt having no supplementary reinforcing or supporting components;
- and
- a polishing surface on a polishing side of the endless loop.
Dependencies are inferred from the claim text.