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US 6,656,029 B2Granted
Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same
AssigneeNEC Electronics Corporation
InventorHideki Kitahata
Life of this patent
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Abstract
In a semiconductor device having a front surface where circuits are formed and a back surface, a hemispherical solid immersion lens is formed at the back surface of the semiconductor device in a body with the semiconductor device.
Claims12
An apparatus for manufacturing a hemispherical solid immersion lens at a back surface of a semiconductor device, comprising:
- a pedestal;
- a grinding tool, fixed to said pedestal,
- for grinding the back surface of said semiconductor device, said grinding tool having a
- hemicircularly-cross-sectional groove perpendicular to a rotation axis of said grinding tool;
- a microscope, fixed to said pedestal, for detecting a reference location of said semiconductor device;
- and
- an alignment mechanism, movably mounted on said pedestal, for moving said semiconductor device in relation to said grinding tool and said microscope.
4 more elements
An apparatus for manufacturing a hemispherical solid immersion lens at a back surface of a semiconductor device, comprising:
- a pedestal;
- a grinding tool, fixed to said pedestal,
- for grinding the back surface of said semiconductor device, said grinding tool having a
- hemicircularly-cross-sectional groove perpendicular to a rotation axis of said grinding tool;
- and
- an alignment mechanism, movably mounted on said pedestal, for moving said semiconductor device in relation to said grinding tool,
- said grinding tool being adapted to a circular recess formed at the back surface of said semi conductor device.
4 more elements
Dependencies are inferred from the claim text.