Method for loading a semiconductor processing system

A method for loading a processing system, comprising the steps of:

• queuing a first substrate storage cassette on a first door assembly having a first portion fixedly coupled to a second portion;
• positioning the second portion to close a first aperture in a factory interface;
• displacing the second portion to open the first aperture;
• transferring the first substrate storage cassette into the factory interface through the first aperture:
• and
• closing the first aperture with the first portion.

A method for loading a processing system, comprising the steps of:

• providing a first substrate cassette supported by a first portion of a door assembly in a position where substrates contained in the first substrate cassette may be accessed by a robot that transfers the substrates from a factory interface to a processing area for processing;
• moving the first portion of the door assembly to a position where the first substrate cassette may not be accessed by the robot;
• closing a passage to the factory interface with the first portion of the door assembly;
• replacing the first substrate cassette with a second substrate cassette supported on a second portion of the door assembly, which is fixedly coupled to the first portion and disposed outside of the factory interface, while the system continues to process other substrates;
• and
• returning the first portion of the door assembly to the position where the second substrate cassette may be accessed by the robot.