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US 6,656,025 B2Granted
Integrated pad and belt for chemical mechanical polishing
AssigneeLam Research Corporation
InventorsAnil K. Pant, Rahul Jairath, Kamal Mishra, Saket Chadda, Wilbur C. Krusell
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Abstract
An integrated pad and belt for polishing a surface comprising a belt integrated with a polishing pad that forms a seamless polishing surface.
Claims13
A method of integrating a polishing pad with a belt to form seamless integrated pad and belt for polishing a surface, comprising:
- forming a belt;
- and
- integrating said belt with a polishing pad formed during said integrating step to form said seamless integrated pad and belt, wherein said integrating step reduces irregularities on a polishing surface such that said seamless integrated pad and belt comprises a seamless polishing surface, and wherein integrating said belt with said polishing pad further comprises integrating a second polishing pad on a side of said belt opposite said seamless polishing surface.
A method of integrating a polishing pad with a belt to form a seamless integrated pad and belt for polishing a surface, the method comprising:
- forming a belt, wherein said belt is configured for use on a polishing tool in which said belt is mounted for movement across the surface of a semiconductor substrate, and wherein said belt is formed by:
- aligning a weaving pattern of a tensile material in a direction of intended movement of said belt;
- and
- aligning a weaving pattern of a reinforcing material at an offset angle from said direction of intended movement;
- and
- integrating said belt with a polishing pad formed during said integrating step to form the seamless integrated pad and belt wherein said integrating step reduces irregularities on a polishing surface such tat said seamless integrated pad and belt comprises a seamless polishing surface.
3 more elements
Dependencies are inferred from the claim text.