Method and apparatus for reducing compressed dry air usage during chemical mechanical planarization
AssigneeLam Research Corporation
InventorsJohn M. Boyd, David Wei, Yehiel Gotkis
Life of this patent
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Abstract
A retaining ring is provided. The retaining ring includes a lower annular sleeve having a base. The base has an inner sidewall and an outer sidewall extending therefrom. The lower annular sleeve has at least one hole defined therein. An upper annular sleeve is moveably disposed over the lower annular sleeve. The upper annular sleeve has a top, that has at least one hole defined therein. The top has an inner sidewall and an outer sidewall extending therefrom. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.
Claims8
A chemical mechanical planarization (CMP) system, the system comprising:
- a polishing surface;
- a platen disposed along an underside of the polishing surface, the platen configured to be coupled to a first fluid source;
- and
- a retaining ring surrounding the platen, the retaining ring including a lower annular sleeve and an upper annular sleeve moveably disposed over the lower annular sleeve, and the lower annular sleeve being fixed and having at least one hole configured to be coupled to a second fluid source.
Dependencies are inferred from the claim text.