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US 6,656,022 B2Granted
Method for polishing a semiconductor substrate member
AssigneeHitachi, Ltd.
InventorsKatsuhiro Ota, Akio Saito
Life of this patent
Estimating the term…
Abstract
A polishing slurry prepared by dispersing in a dispersion medium, abrasive grains comprised of a material having a solubility in the dispersion medium at 25° C., of 0.001 g/100 g or higher is used to effectively remove any abrasive grains standing adherent to the surfaces of objects to be polished or the interiors of polishing apparatus after polishing.
Claims11
A method for polishing a surface of a semiconductor substrate member, comprising:
- polishing said surface using a polishing slurry comprising a dispersion medium and abrasive grains dispersed in the dispersion medium, said abrasive grains consisting of a crystal material precipitated in said dispersion medium and having a solubility in the dispersion medium, at 25° C., of at least 0.001 g/100 g.
The method for polishing a surface of a semiconductor substrate member, comprising:
- polishing said surface using a polishing slurry that comprises a dispersion medium and abrasive grains dispersed in the dispersion medium, wherein the abrasive grains are a crystal precipitated in said dispersion medium
- wherein said abrasive grains may be dissolved in part in the dispersion medium, so as to vary the quantity of dispersion of the abrasive grains dispersed in the polishing slurry in the form of a solid.
The method for polishing a surface of a semiconductor substrate member, comprising:
- polishing said surface using a polishing slurry that comprises a dispersion medium and abrasive grains dispersed in the dispersion medium, wherein the abrasive grains are a crystal precipitated in said dispersion medium and
- wherein the solubility of the abrasive grains in the dispersion medium is varied by changing the temperature of the polishing slurry, so as to vary the quantity of dispersion of the abrasive grains dispersed in the polishing slurry in the form of a solid.
Dependencies are inferred from the claim text.