Back to results
US 6,656,021 B2Granted
Process for fabricating a semiconductor device
AssigneeHitachi, Ltd.
InventorsKatsuhiro Ota, Akio Saito
Life of this patent
Estimating the term…
Abstract
A polishing slurry prepared by dispersing in a dispersion medium, abrasive grains comprised of a material having a solubility in the dispersion medium at 25° C., of 0.001 g/100 g or higher is used to effectively remove any abrasive grains standing adherent to the surfaces of objects to be polished or the interiors of polishing apparatus after polishing.
Claims11
A process for fabricating a semiconductor device, comprising:
- forming a thin film on a semiconductor substrate;
- and
- polishing a surface of said thin film,
- wherein the surface of said thin film is polished by using a polishing slurry comprising a dispersion medium and abrasive grains dispersed in the dispersion medium, said abrasive grains consisting of a crystal material precipitated in said dispersion medium and having a solubility in the dispersion medium, at 25° C., of at least 0.001 g/100 g.
1 more element
A process for fabricating a semiconductor device, comprising:
- forming a thin film on a semiconductor substrate;
- and
- polishing a surface of said thin film,
- wherein:
- said polishing is carried out by supplying on the surface of said thin film a polishing slurry comprising abrasive grains dispersed in a dispersion medium;
- said abrasive grains being comprised of a crystal material precipitated in said dispersion medium and
- wherein, in said polishing, said abrasive grains may be dissolved in part in the dispersion medium, so as to vary the quantity of dispersion of the abrasive grains dispersed in the dispersion medium in the form of a solid.
4 more elements
A process for fabricating a semiconductor device, comprising:
- forming a thin film on a semiconductor substrate;
- and
- polishing a surface of said thin film,
- wherein:
- said polishing is carried out by supplying on the surface of said thin film a polishing slurry comprising abrasive grains dispersed in a dispersion medium;
- and
- a quantity of dispersion of said abrasive grains is varied in the course of said polishing,
- wherein, in said polishing, the solubility of the abrasive grains in the dispersion medium is varied by changing the temperature of the polishing slurry, so as to vary the quantity of dispersion of the abrasive grains dispersed in the dispersion medium in the form of a solid.
5 more elements
Dependencies are inferred from the claim text.