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AssigneeFreudenberg Nonwovens Limited Partnership
InventorsOscar K. Hsu, Jean K. Vangsness, Scott C. Billings, David S. Gilbride
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A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component, preferably fibrous, within a polymer matrix component. The fibrous component includes fibers soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the fibrous substance or topographically coated on the fibrous substance.
A work pad for polishing a substrate in the presence of a slurry comprising abrasive particles and a dispersive agent, comprising:
A process of polishing a substrate using a work pad, comprising:
A work pad for polishing a substrate in the presence of a slurry comprising abrasive particles and a dispersive agent, comprising:
A work pad for polishing a substrate in the presence of a slurry comprising abrasive particles and a dispersive agent, comprising:
A work pad for polishing a substrate in the presence of a slurry comprising abrasive particles and a dispersive agent, comprising:
Dependencies are inferred from the claim text.