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US 6,655,964 B2Granted
Low cost integrated out-of-plane micro-device structures and method of making
AssigneeXerox Corporation
InventorsDavid K. Fork, Christopher L. Chua, Koenraad F. Van Schuylenbergh, Noble M. Johnson, David K. Biegelsen
Life of this patent
Estimating the term…
Abstract
Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the elastic members have graded perforations for controlling rate of release. In another method and structure, a layout enables the contact landing area to be increased. The high yield structures may be used in numerous electronic applications such as filter circuits.
Claims11
An out-of-plane structure, comprising:
- a substrate;
- and
- an elastic member comprising a first anchor portion fixed to the substrate, a spring and a free end;
- wherein the elastic member further includes a plurality of perforations unequally spaced apart from one another in the spring;
- wherein the free end and the spring are initially fixed to the substrate, but are released from the substrate to become separated from the substrate, and wherein an intrinsic stress profile in the elastic member biases the free end away from the substrate forming the spring and wherein on release of the free end, the perforations in the elastic member control a rate of release of the elastic member from the substrate.
2 more elements
An out-of-plane structure, comprising:
- a substrate;
- and
- an elastic member comprising a first anchor portion, a loop winding and a second anchor portion, the first anchor portion being fixed to the substrate, the second anchor portion being connected to the substrate;
- wherein the elastic member further includes a plurality of perforations unequally spaced apart from one another in the elastic member;
- wherein the second anchor portion and the loop winding are initially fixed to the substrate, but are released from the substrate to become separated from the substrate, and wherein an intrinsic stress profile in the elastic member biases the second anchor portion away from the substrate forming the loop winding and causing the second anchor portion to contact the substrate and wherein on release of the second anchor, the perforations in the elastic member control a rate of release of the elastic member from the substrate.
2 more elements
A device comprising:
- a substrate;
- and
- a circuit having at least one reactance element, formed on the substrate;
- wherein the reactance element comprises at least one out-of-plane structure comprising:
- an elastic member comprising a first anchor portion fixed to the substrate, a spring and a free end;
- wherein the elastic member further includes a plurality of perforations unequally spaced apart from one another in the spring;
- wherein the free end and the spring are initially fixed to the substrate, but are released from the substrate to become separated from the substrate, and wherein an intrinsic stress profile in the elastic member biases the free end away from the substrate forming the spring and wherein on release of the free end, the perforations in the elastic member control a rate of release of the elastic member from the substrate.
4 more elements
An out-of-plane coil structure, comprising:
- a substrate;
- an elastic member comprising a first anchor portion, a loop winding and a second anchor portion, the first anchor portion and the second anchor portion being fixed to the substrate;
- wherein the elastic member further comprises a first elastic member comprising a first anchor portion and a first free end and a second elastic member comprising a second anchor portion and a second free end;
- wherein the first free end includes an elongated tip and wherein the second free end includes a tip having a groove for receiving the elongated tip to facilitate catching of the first and second elastic members;
- having a groove for receiving the elongated tip to facilitate latching of the two elastic member;
- wherein the first free end and the second free end are initially fixed to the substrate, but are released from the substrate to become separated from the substrate, and wherein an intrinsic stress profile in the first elastic member biases the first free end away from the substrate and wherein an intrinsic stress profile in the second elastic member biases the second free end away from the substrate;
- and
- wherein the first free end and the second free end are connected together forming the loop winding.
5 more elements
A device comprising:
- a substrate;
- and
- a circuit having at least one reactance element, formed on the substrate;
- wherein the reactance element comprises at least one out-of-plane structure comprising:
- an elastic member comprising a first anchor portion, a loop winding and a second anchor portion, the first anchor portion and the second anchor portion being fixed to the substrate;
- wherein the elastic member further comprises a first elastic member comprising a first anchor portion and a first free end and a second elastic member comprising a second anchor portion and a second free end;
- wherein the first free end includes an elongated tip and wherein the second free end includes a tip having a groove for receiving the elongated tip to facilitate catching of the first and second elastic members;
- wherein the first free end and the second free end are initially fixed to the substrate, but are released from the substrate to become separated from the substrate, and wherein an intrinsic stress profile in the first elastic member biases the first free end away from the substrate and wherein an intrinsic stress profile in the second elastic member biases the second free end away from the substrate;
- and
- wherein the first free end and the second free end are connected together forming the loop winding.
7 more elements
Dependencies are inferred from the claim text.