Optoelectronic package with dam structure to provide fiber standoff

An optoelectronic package comprising:

• a base substrate having at least one electrically conductive trace thereon;
• a photonic device carried by the base substrate, the photonic device having an active facet and at least one bond pad thereon;
• at least one reverse bonded bonding wire, each reverse bonded bonding wire being ball bonded to an associated conductive trace on the base substrate and stitch bonded to an associated bond pad;
• an optical fiber in optical communication with the facet on the photonic device;
• and
• a dam structure formed on the base substrate, the dam structure being sized to define a desired standoff between the optical fiber and the photonic device.

An optoelectronic component comprising:

• a flexible base substrate having at least one electrically conductive trace thereon;
• an optical component support block that supports the flexible base substrate;
• a photonic device mounted on the base substrate, the photonic device having an active facet thereon;
• an optical fiber in optical communication with the facet on the photonic device;
• and
• a dam structure formed by dispensing a flowable material on the base substrate and hardening the dispensed material, the dam structure being sized to define a desired standoff between the optical fiber and the photonic device.

A method of packaging an optoelectronic device comprising:

• attaching a photonic device directly or indirectly to a base substrate;
• forming a registration dam on the base substrate by dispensing an accurate volume of a flowable material on the base substrate and hardening the dispensed material to form the registration dam;
• and
• positioning an optical fiber over the photonic device such that the registration dam sets a desired optical standoff distance between an active facet of the photonic device and the optical fiber.

A method of packaging an optoelectronic device comprising:

• attaching a photonic device to a base substrate;
• forming a registration dam on the base substrate by dispensing an accurate volume of a flowable epoxy based material on the base substrate and curing the dispensed material to form the registration dam;
• reverse wire bonding at least one bond pad on the photonic device to an associated trace on the base substrate, the height of the registration dam being sufficiently high to prevent the optical fiber from contacting a bonding wire formed by the wire bonding;
• and
• positioning an optical fiber over the photonic device such that the registration dam sets a desired optical standoff distance between an active facet of the photonic device and the optical fiber.