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AssigneesHRL Laboratories, LLC, Hughes Electronics Corporation
InventorsDaniel Yap, Michael Yung
Estimating the term…
Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.
A method for fabricating an interconnection for interconnecting microelectronic chips with optical wires, said method comprising steps of:
A method of making an interconnection or a substrate for interconnecting a microelectronic chip on the substrate with an optical fiber, said method comprising:
An interconnection on a substrate for interconnecting a microelectronic chip on the substrate with an optical fiber, said interconnection comprising:
An optical interconnection for connecting two integrated circuits by an optical fiber, each integrated circuit including an integrated circuit substrate and a chiplet mounted on the integrated circuit substrate for connection to said optical fiber, each chiplet having:
An optical interconnection for connecting an optical fiber to an integrated circuit by an optical fiber, the integrated circuit including an integrated circuit substrate and a chiplet mounted on the integrated circuit substrate for connection to said optical fiber, the chiplet having:
Dependencies are inferred from the claim text.