Apparatus for selective soldering

Abstract

The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially vertically above the soldering vessel, pump means for feeding molten solder to the underside of the tube, and moving means for moving into at least the vicinity of each other the underside of the printed circuit board for soldering and the upper side of the tube, wherein an outflow opening is arranged in each of the tubes at some distance from the upper side of said tubes. By arranging the outflow opening at some distance from the upper side of the tube the outflowing solder flow will no longer contact the printed circuit board and the components present thereon thus allowing more freedom in the design of the printed circuit board and the placing of the components thereon. Heat transfer to the solder on the upper side of the tube takes place through heat flow inside the solder from the thermal contact with the solder flowing thereunder out of the outflow opening.

Dependencies are inferred from the claim text.