Implementing micro BGA assembly techniques for small die
AssigneeIntel Corporation
InventorsSteven R. Eskildsen, Richard B. Foehringer, Deborah S. Kaller
Life of this patent
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Abstract
A method of implementing a micro BGA is introduced. More specifically, the method discloses packaging an integrated circuit into an integrated circuit assembly. The method first mounts polyimide tape to a lead frame. The polyimide tape serves as a substrate for the integrated circuit package. Next, a piece of elastomer is coupled to said polyimide tape. Then an integrated circuit die is attached to said elastomer. Lead beams are then bonded from bond pads on said die to said lead frame. Solder balls are attached to said lead frame. The attached solder balls may be located beyond the area of said die.
Claims11
A method of packaging an integrated circuit into an integrated circuit assembly, said method comprising:
- mounting flexible polyimide tape to a lead frame, wherein said flexible polyimide tape serves as a substrate of a micro BGA package;
- coupling elastomer to said flexible polyimide tape;
- attaching a die to said elastomer;
- bonding lead beams from bond pads on said die to said lead frame;
- attaching a solder mask to said lead frame, said solder mask having a plurality of solder mask openings to expose solder landings on said lead frame, said solder mask having a larger size than said die wherein length and width dimensions of said solder mask extend beyond length and width dimensions of said die;
- encapsulating a periphery of said die, said lead beams, and said solder mask with an encapsulation material, wherein a plurality of stiffener piece parts are added to said encapsulation material beyond said periphery of said die, said stiffener piece parts to provide a stiffening function for said micro BGA package;
- and
- attaching solder balls to solder landings coupled on said lead frame, said solder balls arranged in a ball grid array wherein at least one of said attached solder balls is located beyond surface area of said die in a horizontal direction such that said attached solder balls overhang area of said die.
Dependencies are inferred from the claim text.