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AssigneeInternational Business Machines Corporation
InventorsTimothy F. Carden, Glenn O. Dearing, Kishor V. Desai, Stephen R. Engle, Randall Stutzman, George H. Thiel
Estimating the term…
A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.
A method of packaging a chip in a package, the package having a carrier, a stiffener having an opening in which the chip is positioned on the carrier, and a cover plate to cover the opening, the method comprising the steps of:
Dependencies are inferred from the claim text.