Microactuator for use in mass data storage devices, or the like, and method for making same

A method for making a microactuator, comprising:

• providing first, second, and third substrates;
• adhering said first and second silicon wafers together;
• thinning said first silicon wafer to a desired substrate thickness;
• patterning first windows through said first silicon wafer to form a mold;
• forming coil and flux-conducting interconnect features in respective said first windows through said first substrate;
• forming first partial microactuator structures on one side of said first substrate by:
• patterning a first layer of photoresist on said one side of said first substrate to form a mold to contain coil portions and coil interconnection traces;
• molding coil material into the mold of said first layer of photoresist to form said coil portions and said coil interconnection traces;
• removing said first layer of photoresist;
• forming a first permanent dielectric layer overall;
• patterning said first permanent dielectric layer to form second windows to expose said flux-conducting interconnect features;
• forming additional flux-conducting features in said second windows of said first permanent dielectric layer to contact said exposed flux-conducting interconnect features;
• patterning a second photoresist layer over said first layer of dielectric to form a mold for top flux-conducting features;
• forming top flux-conducting features in said mold in said second photoresist layer;
• stripping the second photoresist layer;
• forming at least a portion of a gap between two nickel-iron bars;
• attaching said third substrate to said nickel-iron features;
• forming second partial microactuator structures on another side of said first substrate by repeating the steps to form the first partial microactuator for said another side of said first substrate;
• and removing said second and third substrates from said first substrate.