US 6,653,245 B2Granted

Method for liquid phase deposition

AssigneeIndustrial Technology Research Institute

InventorsMuh-Wang Liang, Pang-Min Chiang, Chen Max, Jen-Rong Huang, Ching-Fa Yeh

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Abstract

A method for liquid phase deposition, including the steps of providing at least two raw materials from at least two supply devices of a saturation reaction system into a mixture trough and stirring until saturation occurs, filtering out unnecessary solid-state particles, and providing saturated and filtered liquid into an over-saturation reaction trough of a steady-flow over-saturation loop reaction system and stopping the saturated and filtered liquid when the over-saturation reaction trough is filled and the saturated and filtered liquid over-flows into a liquid level control trough to a pre-determined level. The method also includes the steps of providing a substrate in the over-saturation reaction trough, providing reactants from at least two supply devices into the over-saturation reaction trough, and depositing a thin film onto the substrate when the saturated liquid becomes over-saturated.

Claims3

Dependent claims

A method for liquid phase deposition, comprising the steps of:

(a) providing an apparatus for liquid phase deposition, the apparatus has a saturation reaction system and a steady-flow over-saturation loop reaction system, the saturation reaction system including a mixture trough, at least two supply devices for raw materials, and valve control devices, the steady-flow over-saturation loop reaction system including an over-saturation reaction trough, at least one liquid level control trough, at least two said supply devices for raw materials, and said valve control devices connected to said saturation reaction system;
(b) providing at least two raw materials from at least two said supply devices of said saturation reaction system into said mixture trough;
(c) after stirring by said stirrer device until saturation, filtering out unnecessary solid-state particles by using said filter device;
(d) providing saturated and filtered liquid by using said pumps through said valve control devices into said over-saturation reaction trough of said steady-flow over-saturation loop reaction system;
(e) stopping providing said saturated and filtered liquid when said over-saturation reaction trough is filled up with said saturated and filtered liquid and said saturated and filtered liquid over-flows into said at least one liquid level control trough to a pre-determined level;
(f) switching said valve control devices into a state in which said steady-flow over-saturation loop reaction system runs independently;
(g) providing a substrate into said over-saturation reaction trough;
(h) providing reactants from said at least two supply devices into said over-saturation reaction trough;
(i) depositing a thin film into said substrate when said saturated liquid becomes over-saturated;
and
(j) changing the operation mode of said valve control devices to an exhaust mode when the concentration of said solution in said over-saturation reaction trough has reached the limitation of said over-saturation reaction trough.

8 more elements

A method for liquid phase deposition, comprising the steps of:

(a) providing an apparatus for liquid phase deposition, the apparatus has a saturation reaction system and a steady-flow over-saturation loop reaction system, the saturation reaction system including a mixture trough, at least two supply devices for raw materials, and valve control devices, the steady-flow over-saturation loop reaction system including an over-saturation reaction trough, at least one liquid level control trough, at least two said supply devices for raw materials, and said valve control devices connected to said saturation reaction system;
(b) providing at least two raw materials from at least two said supply devices of said saturation reaction system into said mixture trough;
(c) after stirring by said stirrer device until saturation, filtering out unnecessary solid-state particles by using said filter device;
(d) providing saturated and filtered liquid by using said pumps through said valve control devices into said over-saturation reaction trough of said steady-flow over-saturation loop reaction system;
(e) stooping providing said saturated and filtered liquid when said over-saturation reaction trough is filled up with said saturated and filtered liquid and said saturated and filtered liquid over-flows into said at least one liquid level control trough to a pre-determined level;
(f) switching said valve control devices into a state in which said steady-flow over-saturation loop reaction system runs independently;
(g) providing a substrate into said over-saturation reaction trough;
(h) providing reactants from said at least two supply devices into said over-saturation reaction trough;
(i) depositing a thin film into said substrate when said saturated liquid becomes over-saturated;
(j) adding de-ionized water into said over-saturation reaction trough until said over-saturation reaction trough is filled up and said solution over-flows from said over-saturation reaction trough into said liquid level control trough;
(k) stopping providing said de-ionized water and switching the operation mode of said valve control devices of a loop mode;
and
(l) exhausting waste liquid.

10 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/874,108Filed 6 Jun 2001
Priority: TW 90111668 A16 May 2001
Published: US 2002/0173170 A121 Nov 2002
Granted: 25 Nov 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10P 72/0426
For wet etching: with the semiconductor substrates being dipped in baths or vessels
H10P 14/60
Formation of materials, e.g. in the shape of layers or pillars: of insulating materials
Y10T 137/4643
With liquid valves or liquid trap seals: liquid valves
Y10T 137/4891
Fluid handling: with holder for solid, flaky or pulverized material to be dissolved or entrained