Methods and apparatus for conditioning and temperature control of a processing surface

In a chemical mechanical planarization (CMP) system, the CMP system having a first roller, a second roller, and a linear belt, the linear belt circulating around the first roller and the second roller, the linear belt having a width that spans between a first edge and a second edge, the linear belt having an outer processing surface and an inner surface, a method for controlling the temperature of the linear belt, comprising:

• applying thermal energy to a linear array of locations on the inner surface of the linear belt, the linear array of locations spanning from the first edge to the second edge of the width of the linear belt;
• and
• controlling a degree of the applied thermal energy at each of the linear array of locations.

In a chemical mechanical planarization (CMP) system, the CMP system having a first roller, a second roller, and a linear belt, the linear belt circulating around the first roller and the second roller, the linear belt having a width that spans between a first edge and a second edge, the linear belt further having an outer preparation surface and an inner surface that contacts the first roller and the second roller, a preparation surface conditioner, comprising:

• an array of conditioning pucks for conditioning the outer preparation surface of the linear belt, each of the conditioning pucks of the array being independently controlled, the array of conditioning pucks extending between the first edge and the second edge of the linear belt width.

In a chemical mechanical planarization (CMP) system, the CMP system having a first roller, a second roller, and a linear belt, the linear belt circulating around the first roller and the second roller, the linear belt having a width that spans between a first edge and a second edge, the linear belt having an outer processing surface and an inner surface, a method for conditioning the outer processing surface of the linear belt, comprising:

• distributing a plurality of independent conditioning elements along a linear path extending between the first edge and the second edge of the linear belt;
• and
• applying each of the plurality of independent conditioning elements to the outer processing surface along the linear path.