Method and apparatus for uniformly planarizing a microelectronic substrate
AssigneeMicron Technology, Inc.
InventorsStephen J. Kramer, Scott Meikle
Life of this patent
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Abstract
A method and apparatus for planarizing a microelectronic substrate. The apparatus can include a planarizing medium having a relatively hard polishing pad and a planarizing liquid disposed on a generally non-porous planarizing surface of the polishing pad. The planarizing liquid can include a colloidal suspension of colloidal particles having generally smooth external surfaces. The colloidal particles can have a variety of shapes, including a spherical shape, a cylindrical shape, a cubic shape, and a hexagonal shape, among others. The colloidal particles can be formed from a variety of materials, including silicon dioxide, manganese oxide, and cerium oxide.
Claims5
A method for removing material from a surface of a microelectronic substrate, comprising:
- selecting a polishing pad to include a polyurethane material having a generally non-porous planarizing surface, a modulus of elasticity of approximately 1.0×109 pascals, and a Shore D hardness of approximately 60;
- selecting a planarizing liquid to include a colloid having generally spherically shaped silicon dioxide colloidal particles having a surface roughness with a mean height of between 0.01% and 10% of the particles mean diameter;
- disposing the planarizing liquid and colloidal particles on a planarizing surface of the polishing pad;
- engaging the surface of the microelectronic substrate with the planarizing liquid and the planarizing surface of the polishing pad;
- and
- moving at least one of the microelectronic substrate and the polishing pad relative to the other of the microelectronic substrate and the polishing pad to remove material from the surface of the microelectronic substrate.
Dependencies are inferred from the claim text.