Loading patent…
AssigneeShin-Etsu Handotai Co., Ltd.
InventorsShunichi Ikeda, Sadayuki Okuni, Tadahiro Kato
Estimating the term…
In a double side simultaneous grinding machine, in which a plate-like workpiece is held and ground simultaneously on both a front surface and a back surface using a pair of grinding stones provided oppositely at both sides of the workpiece, a relative position between at least one of the center of thickness of the plate-like workpiece and the center of the holding means for holding the workpiece, and the center between stone surfaces of the pair of grinding stones is controlled during grinding. In a double side simultaneous grinding method, the generation of warpage of the plate-like workpiece is suppressed and degradation of warpage is prevented. Thereby, the plate-like workpiece can be processed to have high flatness on both sides. Further, the plate-like workpiece can be ground while a degree of warpage is controlled so that the workpiece is processed to have a warpage of a desired degree.
A method for simultaneously grinding both a front surface and a back surface of a plate-like workpiece, the method comprising:
The method of claim 7, wherein the controlling is such that a difference between the center between stone surfaces of the pair of grinding stones and at least one of the center of thickness of the workpiece and the center of the holding means is a desired value while performing the simultaneous grinding.
A grinding machine, comprising:
A method for simultaneously lapping both a front surface and a back surface of a plate-like workpiece, the method comprising:
A lapping machine, comprising:
Dependencies are inferred from the claim text.