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US 6,650,823 B1Granted
Method of creating a photonic via using fiber optic
AssigneeIntel Corporation
InventorVenkatesan Murali
Life of this patent
Estimating the term…
Abstract
A photonic via is made in a substrate by making a hole in the substrate, heating the substrate, and inserting a fiber optic into the hole. In one embodiment, a lens can be made by applying a polymer on top of the photonic via and curing.
Claims18
A method of making a photonic via in a semiconductor substrate comprising:
- making a hole in the semiconductor substrate;
- inserting a fiber optic into the hole;
- and
- heating the semiconductor substrate to at least temporarily enlarge the hole immediately prior to inserting of the fiber optic.
1 more element
A method of making a photonic via in a semiconductor substrate comprising:
- etching a hole in the semiconductor substrate;
- heating the semiconductor substrate to at least temporarily increase a diameter of the hole;
- and
- inserting a fiber optic into the hole of the semiconductor substrate while the semiconductor substrate is still hot.
1 more element
A method of making a photonic via in a silicon substrate comprising:
- etching a hole in the silicon substrate;
- heating the silicon substrate to temporarily enlarge the hole;
- and
- inserting a fiber optic into the silicon substrate while the hole is temporarily enlarged.
1 more element
Dependencies are inferred from the claim text.