Low profile DC distribution module for a power supply unit
AssigneeHewlett-Packard Development Company, L.P.
InventorsRobert A. Pereira, Paily T. Varghese
Life of this patent
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Abstract
A DC distribution module for a power supply unit is modular and facilitates thermal cooling of the unit. The power supply unit preferably includes a housing in which one or more power supply modules and the DC distribution module can be inserted. The DC distribution module preferably comprises two power conductors laminated and bonded to a ground conductor. The DC distribution module is relatively thin compared to the power supplies inserted into the power supply unit. By being relatively thin, the DC distribution module, which may carry substantial amounts of current, does not substantially interfere with air movement through the power supply unit for thermal cooling purposes.
Claims21
A DC distribution module for a power supply unit that receives electrical power from a power supply, comprising:
- an insulated ground conductor;
- and
- at least one insulated power conductor adhesively attached to said ground conductor, wherein the at least one power conductor has a non-circular cross section;
- and
- wherein said DC distribution module is adapted to be mounted in the power supply unit.
A power supply unit that produces voltage for use by electrical equipment, comprising:
- a housing;
- a power supply that fits into said housing;
- a DC distribution module attached to said housing and electrically connected to said power supply, said DC distribution module including at least one power conductor attached to a ground conductor, wherein the at least one power conductor has a non-circular cross section.
A DC distribution module for a power supply unit that receives electrical power from a power supply, comprising:
- a ground conductor;
- and
- two power conductors formed in an L-shape, each power conductor separately bonded to said ground conductor, wherein said power conductors and said ground conductors have a non-circular cross section and the thickness of the combined ground and power conductors is less than 10% of the width of the DC distribution module.
Dependencies are inferred from the claim text.