Ultra-high frequency interconnection using micromachined substrates
AssigneeTriQuint Technology Holding Co.
InventorsFrank F. Judd, Yongqiang Shi
Life of this patent
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Abstract
The present invention provides a device, a method of making the device, and a system incorporating the same. In one embodiment, the device includes a substrate that has first and second opposing surfaces and first and second thicknesses, wherein the second thickness is less than the first thickness, and the first surface is substantially planar. The device further includes a conductive trace having an input end and an output end and located over the first surface of the substrate, wherein at least one of the input end or output end is aligned with the second substrate thickness.
Claims19
An electronics device, comprising:
- a substrate having first and second opposing surfaces and first and second thicknesses wherein the second thickness is substantially less than the first thickness and the first surface is substantially planar;
- and
- a conductive trace having an input end and an output end and located over the first surface and wherein at least one of the input end or output end is aligned with the second thickness and wherein the highest frequency of an external signal input is substantially less than a first resonant frequency of the second thickness.
A method of manufacturing an electronics device, comprising:
- providing a substrate having first and second opposing surfaces and first and second thicknesses wherein the second thickness is less than the first thickness and the first surface is substantially planar;
- and
- locating a conductive trace over the first surface, the conducive trace having an input end and an output end, wherein at least one of the input end or output end is aligned with the second thickness and wherein the highest frequency of an external signal input is substantially less than a first resonant frequency of the second thickness.
An optoelectronics system, comprising:
- an electrical signal input;
- and
- an optoelectronics device, including:
- a substrate having first and second opposing surfaces and first and second thicknesses wherein the second thickness is less than the first thickness and the first surface is substantially planar;
- and
- a conductive trace having an input end connected to the electrical signal input cable and an output end and located over the first surface and wherein at least one of the input end and output end is aligned with the second thickness and wherein the highest frequency of an external signal input is substantially less than a first resonant frequency of the second thickness;
- and
- an optical signal modulator coupled to the substrate and adjacent the conductive trace.
Dependencies are inferred from the claim text.