Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same
AssigneeClarisay, Inc.
InventorsMartin Goetz, Sarah Schwab
Life of this patent
Estimating the term…
Abstract
A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate and (3) a passivation layer located over the SAW circuit conductors, the substrate and the passivation layer cooperating to form a hermetic seal to isolate the SAW circuit conductors from an environment proximate the package.
Claims14
A surface acoustic wave (SAW) circuit package, comprising:
- a substantially planar piezoelectric substrate;
- SAW circuit conductors located over said substrate, wherein said SAW circuit conductors cooperate to form multiple SAW resonators;
- a passivation layer located over said SAW circuit conductors, said substrate and said passivation layer cooperating to form a hermetic seal to isolate said SAW circuit conductors from an environment proximate said package;
- and
- at least one via formed through said passivation layer for contacting at least one of said SAW circuit conductors, wherein said at least one via contains metal, said metal contacting said at least one of said SAW circuit conductors to form a terminal therefor.
A method of manufacturing a surface acoustic wave (SAW) circuit package, comprising:
- creating a substantially planar piezoelectric substrate;
- fanning SAW circuit conductors over said substrate, wherein said SAW circuit conductors cooperate to form multiple SAW resonators;
- forming a passivation layer over said SAW circuit conductors, said substrate and said passivation layer cooperating to form a hermetic seal to isolate said SAW circuit conductors from an environment proximate said package;
- and
- forming at least one via through said passivation layer for contacting at least one of said SAW circuit conductors, wherein said at least one via contains metal, said metal contacting said at least one of said SAW circuit conductors to form a terminal therefor.
A surface acoustic wave (SAW) circuit package, comprising:
- a substantially planar piezoelectric substrate having a first footprint;
- SAW circuit conductors located over said substrate, wherein said SAW circuit conductors cooperate to form multiple SAW resonators;
- and
- a passivation layer located over said SAW circuit conductors and having a second footprint coextensive with said first footprint, said substrate and said passivation layer cooperating to form a hermetic seal to isolate said SAW circuit conductors from an environment proximate said package, said passivation layer including a plurality of vias containing metal, said metal contacting said SAW circuit conductors to form terminals therefor.
Dependencies are inferred from the claim text.