Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system

A bumped semiconductor chip exhibiting enhanced pattern recognition when illuminated in a machine vision system, comprising:

• a flip chip integrated circuit having a plurality of solder bumps on an active face thereof;
• an underfill material coated on the active face;
• and
• a flux containing a colorant, deposited only on each of the solder bumps to modify the optical characteristics of the solder bumps when illuminated by a light source in the machine vision system.

In the automatic high speed assembly of bumped semiconductor chips to printed circuit boards, a bumped semiconductor chip exhibiting enhanced pattern recognition when illuminated in a machine vision system, comprising:

• a flip chip integrated circuit having a plurality of solder bumps on an active face thereof;
• an underfill material coated on the active face such that at least a portion of each of the solder bumps remains uncoated;
• and
• a flux containing a red dye, deposited only on each of the solder bumps, to modify the optical characteristics of the solder bumps when illuminated by a red light source in the machine vision system.

A bumped semiconductor package exhibiting enhanced pattern recognition when illuminated in a machine vision system, comprising:

• a circuit carrying substrate having first and second sides;
• a semiconductor device electrically and mechanically mounted on the first side of the circuit carrying substrate;
• the circuit carrying substrate second side having a substantially coplanar array of solder bumps;
• a coating of an underfill material on the circuit carrying substrate second side;
• a fluxing composition containing an image enhancing agent, selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps;
• and
• wherein the deposited image enhancing agent causes the solder bumps to appear bright against the underfill material when the circuit carrying substrate second side is illuminated by selected wavelengths of light.