Semiconductor device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorYoshiharu Takahashi
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Abstract
A semiconductor device using a lead frame as a wiring base member, in which lead electrodes connected to a semiconductor chip through a connecting lead are arranged radially around the semiconductor chip having an upper surface and an under surface. The semiconductor chip, connecting leads, and lead electrodes are integrally sealed in a resin. Each of the lead electrodes includes a thin internal lead portion having a connection part on an upper surface side, and a thick external electrode portion protruding toward an under surface side to form a connection part. The resin has an underside which is substantially co-planar with the under surface of the internal lead portion of the lead electrodes, and the external electrode portion protrudes from the underside of the resin.
Claims6
A semiconductor device comprising:
- a semiconductor chip including a first surface having a plurality of pad electrodes, and a second surface;
- a plurality of lead electrodes, each lead electrode corresponding to one of said plurality of pad electrodes, extending radially relative to said semiconductor chip;
- connecting means connecting said respective lead electrodes to corresponding pad electrodes;
- and
- a resin encapsulating said semiconductor chip, said lead electrodes, and said connecting means, wherein
- each of said plurality of lead electrodes includes
- an internal lead portion having a first thickness and connected to said connecting means on an upper surface side of said lead electrode, and
- an external electrode portion having a second thickness, larger than the first thickness, and protruding toward an under surface side of said lead electrodes as an external connection part,
- said resin has
- an underside substantially co-planar with the under surface side of said internal lead portions of said lead electrodes, and
- a protruding peripheral portion protruding outwardly from a lateral side of said resin and contiguous with the underside of said resin, and
- said external electrode portion protrudes outwardly from the underside of said resin.
A semiconductor device comprising:
- a semiconductor chip including a first surface having a plurality of pad electrodes, and a second surface;
- a plurality of lead electrodes, each lead electrode corresponding to one of said plurality of pad electrodes, extending radially relative to said semiconductor chip;
- connecting means connecting said respective lead electrodes to corresponding pad electrodes;
- and
- an auxiliary electrode surrounding and electrically isolated from said plurality of lead electrodes;
- and
- a resin encapsulating said semiconductor chip, said lead electrodes, said connecting means, and said auxiliary electrode, wherein
- each of said plurality of lead electrodes includes
- an internal lead portion having a first thickness and connected to said connecting means on an upper surface side of said lead electrode, and
- an external electrode portion having a second thickness, larger than the first thickness, and protruding toward an under surface side of said lead electrode as an external connection part,
- said resin has an underside substantially co-planar with the under surface side of said internal lead portions of said lead electrodes, and
- said external electrode portion protrudes outwardly from the underside of said resin and said auxiliary electrode protrudes outwardly from a lateral side of said resin.
Dependencies are inferred from the claim text.