Unique feature design enabling structural integrity for advanced low K semiconductor chips

A semiconductor device, comprising:

• a semiconductor substrate having an active device region and a passive region with multiple wiring levels extending therefrom to an uppermost wiring level of said semiconductor device and with at least some of said multiple wiring levels separated by low-k dielectric insulating material;
• a plurality of conductive pads formed at said uppermost wiring level and at each successive wiring level therebeneath to at least the lowest of said wiring levels that is deposited upon other than a layer of low-k dielectric insulating material, said plurality of pads at each wiring level interconnected to one another by conductive lines;
• and
• a plurality of conductive vias in contact with and arranged between each of said plurality of pads beginning at said uppermost wiring level and each of said conductive pads at the next lower wiring level and thence between each of the said plurality of conductive pads at each successive said wiring level therebeneath to the said at least lowest of said wiring levels.