US 6,650,008 B2 · Stacked semiconductor packaging device

Abstract

A stacked semiconductor packaging device consists of at least a stacked multi-chip device comprising a substrate. A first chip has a back surface faced towards the substrate and an active surface comprising a plurality of bonding pads which have a first set of elongate conductors connected to the substrate. A second chip has another back surface and another active surface comprising a plurality of bonding pads which have a second set of elongate conductors connected to the substrate. The active surface of the second chip is faced towards the active surface of said first chip and is stacked atop the first chip so as to expose all of the bonding pads. The face-to-face arrangement of the first chip and the second chip can reduce the whole packing height.

Claims25

Dependent claims

A stacked multi-chip device comprising:

a substrate;
a first chip having a first back surface affixed to said substrate and a first active surface, said first active surface comprising a plurality of first bonding pads;
a second chip having a second back surface and a second active surface, said second active surface comprising a plurality of second bonding pads, wherein said second active surface is faced towards said first active surface of said first chip and is affixed to and stacked atop said first chip to expose both said first bonding pads and said second bonding pads;
a first set of conductors connecting said first bonding pads with said substrate;
and
a second set of conductors connecting said second bonding pads with said substrate.

3 more elements

Dependencies are inferred from the claim text.

Stacked semiconductor packaging device

Life of this patent

Stacked semiconductor packaging device

Life of this patent

Abstract

Claims25