Micro BGA package
AssigneeWalsin Advanced Electronics LTD
InventorsChia-Yu Hung, Chun-Jen Su, Chien-Hung Lai
Life of this patent
Estimating the term…
Abstract
A micro BGA package comprises a die, a wiring board, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The wiring board has a die-attaching surface, a surface-mounting surface with solder balls, and lateral surfaces between the die-attaching surface and the surface-mounting surface. The package body has a fastener covering and extending around the lateral surfaces of the wiring board for improving the bonding strength between wiring board and die and avoiding delamination. Preferably, the wiring board has a plurality of support bars for supporting the wiring board during molding.
Claims16
A micro BGA (Ball Grid Array) package comprising:
- a wiring board haying a die-attaching surface, a surface-mounting surface, lateral surfaces between the die-attaching surface and the surface-mounting surface, and a plurality of integrally support bars for supporting the wiring board during molding;
- a die attached to the die-attaching surface of the wiring board and having a plurality of bonding pads;
- a plurality of electrically connecting devices connecting the bonding pads with the wiring board;
- a molding package body sealing the plurality of electrically connecting devices, wherein the package body has an integral fastener covering and extending around the lateral surfaces of the wiring board;
- and
- a plurality of solder balls bonded to the surface-mounting surface of the wiring board.
A integrated circuit package comprising:
- a wiring board haying a die-attaching surface, a surface-mounting surface, lateral surfaces between the die-attaching surface and the surface-mounting surface, and integrated support bars;
- a die attached to the die-attaching surface of the wiring board and having a plurality of bonding pads;
- a plurality of electrically connecting devices connecting the bonding pads with the wiring board;
- a package body sealing the plurality of electrically connecting devices and having a fastener extending around the lateral surfaces of the wiring board.
An integrated circuit package comprising:
- a multi-layer wiring board having a die-attaching surface, a surface-mounting surface, integrated support bars, an opening and at least one lateral surface between the die-attaching surface and the surface-mounting surface;
- a die adhered to the die-attaching surface of the wiring board and having a plurality of bonding pads;
- a plurality of electrically connecting devices connecting the plurality of bonding pads of the die to the wiring board;
- and
- a package body sealing the plurality of electrically connecting devices and having a fastener covering the lateral surface of the wiring board to prevent moisture from penetrating into the lateral surface of the wiring board.
Dependencies are inferred from the claim text.