Semiconductor device
AssigneeRohm Co., Ltd.
InventorsYoshitaka Horie, Masahide Maeda
Life of this patent
Estimating the term…
Abstract
A semiconductor device (S1) includes a semiconductor chip (5), a chip-mounting internal lead (1) mounting the semiconductor chip (5), chip-connecting leads (2, 3) electrically connected to an upper surface of the semiconductor chip (5), and a rectangular resin package 7 housing the semiconductor chip (5) and the internal leads (1 to 3). The chip-mounting internal lead (1) has an end which is rectangular or substantially rectangular and extends along the length of the resin package (7).
Claims8
A semiconductor device comprising a semiconductor chip, a chip-mounting internal lead for mounting the semiconductor chip thereon, chip-connecting internal leads connected directly to an upper surface of the semiconductor chip, and a rectangular resin package housing the semiconductor chip and the internal leads,
- wherein the chip-mounting internal lead includes an end which is rectangular or substantially rectangular and extends lengthwise of the resin package,
- wherein the resin package includes a pair of side surfaces spaced apart from each other in a longitudinal direction of the resin package,
- wherein the end of the chip-mounting lead includes a pair of edges spaced apart from each other in the longitudinal direction of the resin package,
- wherein each of the edges of the chip-mounting lead is closer to a corresponding one of the side surfaces of the resin package than to the semiconductor chip, and
- wherein a surface area of the chip-mounting lead is no less than 50% of a bottom area of the resin package.
A semiconductor device comprising first and second semiconductor chips, first and second chip-mounting internal leads for mounting the first and second semiconductor chips, respectively, a plurality of chip-connecting internal leads electrically connected to upper surfaces of the first and second semiconductor chips, and a rectangular resin package housing the first and second semiconductor chips and the first and second internal leads,
- wherein each of the first and second chip-mounting internal leads includes an end which is rectangular or substantially rectangular and extends lengthwise of the resin package, and
- the end of each of the chip-mounting leads is no less than 50% of a bottom area of the resin package.
A semiconductor device comprising a semiconductor chip, a chip-mounting internal lead for mounting the semiconductor chip thereon, chip-connecting internal leads electrically connected to an upper surface of the semiconductor chip, and a rectangular resin package housing the semiconductor chip and the internal leads,
- wherein the chip-mounting internal lead includes an end which is rectangular or substantially rectangular and extends lengthwise of the resin package,
- wherein a surface area of the chip-mounting lead is no less than 50% of a bottom area of the resin package, and
- wherein a non-end portion of the chip-mounting lead has a width which is equal to a width of the end.
Dependencies are inferred from the claim text.