Semiconductor device and method of manufacturing the same
AssigneeFujitsu Limited
InventorsKazuhiko Takada, Shinji Sugatani
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AssigneeFujitsu Limited
InventorsKazuhiko Takada, Shinji Sugatani
Estimating the term…
There are provided the steps of forming a tunnel insulating film on a semiconductor substrate, forming a first semiconductor film constituting a lower portion of a floating gate on the tunnel insulating film, forming device isolation recesses by etching device isolation regions on the first semiconductor film, the tunnel insulating film, and the semiconductor substrate, forming an device isolation insulating film in the device isolation recesses and on the first semiconductor film, removing the device isolation insulating film from an upper surface of the first semiconductor film and thinning the device isolation insulating film on the device isolation recesses, growing selectively a second semiconductor film serving as an upper portion of the floating gate on the first semiconductor film and growing the second semiconductor film on the device isolation insulating film to extend in the lateral direction, forming a dielectric film on the floating gate, and forming a conductive film serving as a control gate on the dielectric film.
A semiconductor device comprising:
A semiconductor device manufacturing method comprising the steps of:
Dependencies are inferred from the claim text.