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US 6,649,937 B2Granted
Semiconductor device with components embedded in backside diamond layer
AssigneeIntel Corporation
InventorsDamion T. Searls, Prateek J. Dujari, Bin Lian
Life of this patent
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Abstract
A semiconductor substrate with integrated circuit devices on its front side and a high thermal conductivity layer such as diamond on its back side, with components such as capacitors embedded in the high thermal conductivity layer and coupled to the front side integrated circuits with vias through the substrate.
Claims17
An apparatus comprising:
- a semiconductor substrate having a front side upon which an active device layer can be fabricated, and having a back side;
- a diamond thermal layer coupled to the back side of the semiconductor substrate;
- a back side component embedded in the diamond thermal layer;
- a via electrically connecting the back side component to the front side of the semiconductor substrate;
- a layer of thermal interface material overlying the diamond thermal layer;
- and
- a thermal solution overlying the layer of thermal interface material.
4 more elements
An apparatus comprising:
- a semiconductor substrate having a front side upon which an active device layer can be fabricated, and having a back side;
- a diamond thermal layer coupled to the back side of the semiconductor substrate;
- a back side component embedded in the diamond thermal layer;
- a via electrically connecting the back side component to the front side of the semiconductor substrate, wherein the back side component comprises a plurality of layers of back side components that comprises a first plate anode and a first plate cathode of a first capacitor.
1 more element
An apparatus comprising:
- a semiconductor die having a front side and a back side;
- integrated circuit devices fabricated on the front side of the semiconductor die;
- a layer of material disposed on the back side of the semiconductor die, the material having a thermal conductivity greater than 150W/mK and an electrical resistivity greater than 1E9Ω-cm;
- and
- an electrical device disposed within the layer of material.
2 more elements
Dependencies are inferred from the claim text.