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US 6,649,930 B2Granted
Thin film composite containing a nickel-coated copper substrate and energy storage device containing the same
AssigneeEnergenius, Inc.
InventorMark Farrell
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Abstract
The invention relates to a process of preparing a copper/nickel substrate by annealing nickel-coated copper. After the nickel deposition step, a dielectric, such as lead zirconate titanate (PZT), may be deposited onto the substrate by methods known in the art such as sol-gel or vacuum deposition. This invention further relates to thin film composites. These composites include a pre-annealed nickel-coated copper substrate and a dielectric such as PZT.
Claims28
A multi-layer thin film composite comprising:
- (a) a nickel-coated copper substrate wherein the nickel is deposited on both sides of the copper substrate;
- (b) a barrier or buffer layer disposed on at least one side of the nickel-coated copper substrate;
- and
- (c) a dielectric layer on the barrier or buffer layer,
- wherein the barrier or buffer layer prevents atomic migration between the substrate and the dielectric layer.
2 more elements
A multi-layer thin film composite comprising:
- (a) an annealed nickel-coated copper substrate;
- and
- (b) a dielectric layer on the nickel-coated copper substrate.
A multi-layer thin film composite comprising:
- (a) an annealed nickel-coated copper substrate wherein the copper substrate is coated on the top and bottom surfaces with nickel;
- (b) a dielectric layer on bottom and top surfaces of the annealed nickel-coated copper substrate;
- and
- (c) a barrier layer or a buffer layer between each of the top and bottom surfaces of the nickel-coated copper substrate and the dielectric layer.
1 more element
Dependencies are inferred from the claim text.